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Electronics Engineering
Failure Analysis
X-ray Analysis
Electronics Engineering
Failure Analysis
X-ray Analysis 
| X-ray Analysis |
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| Written by SK Cheah | |
| Sunday, 11 May 2008 | |
X-ray AnalysisIt is using x-ray penetration capability to investigate any internal physical structures defect (non-destructive method). X-ray photography is a shadow method, where the contrast is due to material (element atomic number), thickness or density differences. The normal X-ray energy range used in electronic industrial is 50 – 160 kV. The soft X-ray energy range is 2 - 10 kV, and useful in other area (especially less harmful to human). Some x-ray system capable to provide geometrically magnification up 5000+, and minimum resolution of 0.1 µm to clearly differentiate small feature. Example of X-ray used in Board level analysis
Example of X-ray used in IC Device analysis
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| Last Updated ( Sunday, 11 May 2008 ) |











